Features
Module configuration:
1G X 72
Memory voltage:The voltage (V) of the memory in the device.
1.2 V
Memory bus:Hardware and software that connects the main memory to the memory controller in computer systems. Originally, general-purpose buses like VMEbus and the S-100 bus were used, but to reduce latency, modern memory buses are designed to connect directly to DRAM chips, and thus are designed by chip standards bodies such as JEDEC.
72 bit
CAS latency:Column Address Strobe (CAS) latency, or CL, is the delay time between the moment a memory controller tells the memory module to access a particular memory column on a RAM module, and the moment the data from the given array location is available on the module's output pins. In general, the lower the CAS latency, the better.
15
ECC:ECC means Error Correction Code, and it is memory that is able to detect and correct some memory errors without user intervention.
Memory form factor:Design of the memory e.g. 240-pin DIMM, SO-DIMM.
288-pin DIMM
Component for:What this product is used as a part of (component for).
PC/Server
Memory clock speed:The frequency at which the memory (e.g. RAM) runs.
2133 MHz
Internal memory type:The type of internal memory such as RAM, GDDR5.
DDR4
Memory layout (modules x size):
1 x 8 GB
Internal memory:A computer's memory which is directly accessible to the CPU.
8 GB
Buffered memory type:
Registered (buffered)
Operational conditions
Operating temperature (T-T):The minimum and maximum temperatures at which the product can be safely operated.
0 - 85 °C
Other features
Internal memory:The amount of memory, usually measured in bytes (e.g. MB, GB), which is installed in the system's hardware.
8192 MB
Memory layout:Describes how memory is plugged on the motherboard
1 x 8192 MB
Weight & dimensions
Height:The measurement of the product from head to foot or from base to top.
31 mm
Width:The measurement or extent of something from side to side.
133.3 mm
