Features
Cooling type:The method used to cool the device or to cool the air around the device.
Heatsink
Intel Extreme Memory Profile (XMP) version:
2.0
Intel Extreme Memory Profile (XMP):
Memory voltage:The voltage (V) of the memory in the device.
1.35 V
CAS latency:Column Address Strobe (CAS) latency, or CL, is the delay time between the moment a memory controller tells the memory module to access a particular memory column on a RAM module, and the moment the data from the given array location is available on the module's output pins. In general, the lower the CAS latency, the better.
16
Memory form factor:Design of the memory e.g. 240-pin DIMM, SO-DIMM.
288-pin DIMM
Component for:What this product is used as a part of (component for).
PC
Memory clock speed:The frequency at which the memory (e.g. RAM) runs.
3600 MHz
Internal memory type:The type of internal memory such as RAM, GDDR5.
DDR4
Memory layout (modules x size):
2 x 8 GB
Internal memory:A computer's memory which is directly accessible to the CPU.
16 GB
Buffered memory type:
Unregistered (unbuffered)
General
Type:Characteristics of the device.
Memory RAM
Operational conditions
Storage temperature (T-T):The minimum and maximum temperatures at which the product can be safely stored.
-55 - 100 °C
Operating temperature (T-T):The minimum and maximum temperatures at which the product can be safely operated.
0 - 85 °C
Weight & dimensions
Height:The measurement of the product from head to foot or from base to top.
35.2 mm
Depth:The distance from the front to the back of something.
138.4 mm
Width:The measurement or extent of something from side to side.
6.4 mm
