Overview



A complete DDR3 memory portfolio for System x and Flex System compute nodes that will help improve the workload performance and energy efficiency. Many applications will see immediate performance benefits with more memory. The DDR3 portfolio includes RDIMMs with advanced error correction for reliability, performance and maximum memory capacity.




Specification


Technical Description:

Features
Memory voltage:The voltage (V) of the memory in the device.
1.5 V
CAS latency:Column Address Strobe (CAS) latency, or CL, is the delay time between the moment a memory controller tells the memory module to access a particular memory column on a RAM module, and the moment the data from the given array location is available on the module's output pins. In general, the lower the CAS latency, the better.
11
ECC:ECC means Error Correction Code, and it is memory that is able to detect and correct some memory errors without user intervention.
Yes
Memory form factor:Design of the memory e.g. 240-pin DIMM, SO-DIMM.
240-pin DIMM
Memory clock speed:The frequency at which the memory (e.g. RAM) runs.
1600 MHz
Internal memory type:The type of internal memory such as RAM, GDDR5.
DDR3
Memory layout (modules x size):
1 x 8 GB
Internal memory:A computer's memory which is directly accessible to the CPU.
8 GB

Packaging data
Package type:The type of product package e.g. box.
DIMM


Product details


90Y3109 IBM

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SKU90Y3109

Quick Code: Q MPN: 90Y3109
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